This two day course follows on from the one day introduction course. it recaps on the handling, placement and rework of Ball Grid Array (BGA) and QFN component types. It covers different component types, handling, storage, placement equipment, removal techniques, pcb preparation, reflow temperature profiling and inspection methods. The main difference with this course is that it is a hands on, practical course with plenty of opportunity for delegates to practice the techniques involved. It can be taken as a stand alone course if the delegate(s) already has knowledge/experience of working with BGA's.